Water jet laser system is particularly suited for cutting larger diamonds having a size of 5 mm or more. Since no focal adjustment is required, a working distance and cutting depth of up to 30 millimetres is possible. Thus, a diamond can be cut in a single setting rather than from both sides as is the case in conventional lasers.

This technology we use for specific high quality rough diamonds with below characteristics:

1. Very less probability of breakage in cutting.
2. Negligible loss of weight.
3. ‘C’ type sawing can be done.
4. Pie sawing can be done.
5. Rough diamond with heavy tension areas can be cut smoothly.
6. Extremely smooth cutting surface can be achieved.

Smooth cutting surface is obtained. There are least chances of breakage in diamond even with high tension in rough diamond. Double-side Sawing (DSS) is done with lowest weight loss.

Its a High Temperature boil Process For Flat Cut Diamonds To Increase Its Light & Luster And Also To Remove Some Impurities.